International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 2Mr Kaichi TsurutaPPUB2018-012024

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/1229/RR PDF file 24 kB
2014-12-11 
1CD
91/1231/CD PDF file 362 kB
2014-12-122014-12
A2CD
91/1254/CC Word file 82 kB
PDF file 124 kB
2015-03-202015-04
CCDV
91/1255/CDV
PDF file 494 kB
2015-05-292015-07
AFDIS
91/1355/RVC Word file 58 kB
PDF file 150 kB
2016-03-252015-11
TFDIS
2017-07-112017-07
DECFDIS
2017-08-242017-08
RFDIS
2017-09-042017-09
CFDIS
91/1468/FDIS

2017-10-062017-11
PRVD
2017-11-172017-11
APUB
91/1488/RVD PDF file 166 kB
2017-11-242017-12
BPUB
2017-11-242017-11
PPUB
2017-12-132018-01
  

Abstract

IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.
This edition includes the following significant technical changes with respect to the previous edition:
a)   The maximum impurity level of Pb has been revised and the table of lead free solder alloys includes some additional lead free solder alloys.

Project

IEC 61190-1-3:2017 ED3

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

 

Remark:

Target date of TFDIS changed to 2017-07 based on decision taken at TC 91 meeting in Frankfurt, Germany 2016-10-14.