International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 3 | Kaichi Tsuruta | PPUB | 2015-01 | 2022 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| AMW |
| 2011-11-22 | ||||
| 1CD |
| 2012-11-08 | 2012-06 | |||
| ACDV |
| 2013-07-19 | 2013-03 | |||
| CCDV |
| 2013-10-02 | 2013-09 | |||
| AFDIS |
| 2014-03-21 | 2014-04 | |||
| DECFDIS | 2014-08-01 | 2014-06 | ||||
| RFDIS | 2014-08-07 | 2014-08 | ||||
| CFDIS |
| 2014-09-26 | 2014-11 | |||
| APUB |
| 2014-12-08 | 2014-11 | |||
| BPUB | 2014-12-09 | 2014-12 | ||||
| PPUB | 2015-01-08 | 2015-01 | ||||
78 kB
91 kBProject
IEC 61189-5-4:2015 ED1
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies