International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 1 | Walter HUCK | PPUB | 2010-03 | 2021 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2007-02-02 | ||||
| ANW |
| 2007-08-24 | 2007-06 | |||
| 1CD |
| 2008-07-04 | 2008-02 | |||
| ACDV |
| 2009-02-20 | 2008-11 | |||
| CCDV |
| 2009-03-06 | 2009-02 | |||
| CCDV |
| 2009-05-01 | ||||
| APUB |
| 2009-10-23 | 2009-11 | |||
| DECPUB | 2010-01-04 | 2010-03 | ||||
| BPUB | 2010-01-13 | 2010-01 | ||||
| RPUB | 2010-01-27 | |||||
| PPUB | 2010-03-16 | 2010-05 | ||||
| 2019-06 | ||||||
Project
IEC 61760-3:2010 ED1
Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering
Associated Documents:
91/1568/RR
92 kB