International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 3 | H. Okamoto | MERGED | 2022 |
History
Stage | Document | Downloads | Decision Date | Target Date |
|---|---|---|---|---|
| DECPUB | 2019-07-31 | |||
| RPUB | 2019-08-14 | |||
| BPUB | 2019-08-20 | 2019-11 | ||
| MERGED | 2019-09-20 | 2019-10 | ||
Project
IEC 61189-5-503/FRAGF ED1
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards