International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 3 | Hiroshi Nishikawa | DEL |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2009-11-06 | ||||
| DEL |
| 2010-03-26 | 2010-03 | |||
339 kBProject
PNW 91-902 ED1
Future IEC 61189-12: Test methods for electrical materials, interconnection structures and assemblies, Part-12 Erosion test method on the materials of solder bath or parts which contact with molten lead free solder.