International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |

Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
---|---|---|---|---|---|
TC 91 | WG 4 | T Koizumi | WPUB | 2007-05 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
---|---|---|---|---|---|---|
PNW |
| 2006-07-21 | ||||
ANW |
| 2007-01-26 | 2006-12 | |||
DECPUB | 2007-02-01 | 2007-02 | ||||
BPUB | 2007-02-27 | 2007-02 | ||||
RPUB | 2007-05-10 | |||||
PPUB | 2007-05-30 | 2007-05 | ||||
WPUB |
| 2015-01-09 | ||||
Project
IEC PAS 61249-3-1:2007 ED1
Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
