International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3 Dr. Chris HUNTDELPUB2007-06 

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/321/MCR PDF file 86 kB
2002-06-14 
1CD
91/404/CD PDF file 338 kB
2003-07-042002-11
ACDV
91/474/CC PDF file 45 kB
2004-08-062003-11
CCDV
91/562/CDV PDF file 401 kB
2005-09-232004-12
CDVM
91/605/RVC PDF file 166 kB
2006-05-122006-05
AFDIS
91/605A/RVC PDF file 169 kB
2006-08-252006-09
DECFDIS
2006-09-292006-10
RFDIS
2006-10-052006-10
CFDIS
91/648/FDIS
2007-02-022007-01
APUB
91/680/RVD PDF file 142 kB
2007-04-132007-04
BPUB
2007-04-162007-05
PPUB
2007-05-092007-06
DELPUB
2017-03-07 
WPUB
  

Abstract

IEC 60068-2-69:2007 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition published in 1995 and constitutes a technical revision. The main changes from the previous edition are as follows:
- Inclusion of lead-free alloy test conditions;
- Inclusion of new fluxes for testing, reflecting development of fluxes that have happened in the industry in the past 20 years;
- Inclusion of new component types, and updating test parameters for the whole component list.

Project

IEC 60068-2-69:2007 ED2

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method