International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 4 | Mr. D.J. Sober | PPUB | 2002-12 | 2023 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2001-01-19 | ||||
| ANW |
| 2001-06-15 | 2001-06 | |||
| CCDV |
| 2001-08-24 | 2001-08 | |||
| AFDIS |
| 2002-04-19 | 2002-04 | |||
| DECFDIS | 2002-09-16 | 2002-11 | ||||
| RFDIS | 2002-09-18 | 2002-10 | ||||
| CFDIS |
| 2002-11-29 | 2002-12 | |||
| APUB |
| 2003-02-11 | 2003-02 | |||
| BPUB | 2003-02-12 | 2003-03 | ||||
| PPUB | 2003-02-27 | 2003-04 | ||||
Project
IEC 61249-2-9:2003 ED1
Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Associated Documents:
52/861/INF
117 kB