International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 4 WPUB2010-07 

History

Stage
Document
Downloads
Decision Date
Target Date
CDPAS
91/893/PAS PDF file 9 kB
2009-10-02 
CDPAS
91/893A/PAS PDF file 1460 kB
2009-10-23 
APUB
91/910/RVD PDF file 243 kB
2010-01-082010-01
DECPUB
2010-05-272010-01
BPUB
2010-06-072010-06
RPUB
2010-06-25 
PPUB
2010-09-292010-08
WPUB
91/1239/RR PDF file 21 kB
2015-01-09 
  

Abstract

IEC/PAS 62326-14:2010(E) is applicable to device embedded substrates fabricated by embedding discrete active and passive electronic devices into an inner layer of a substrate with electric connections by vias, conductor plating, conductive paste, and printing. The device embedded substrate may be used as a substrate to mount SMDs to form electronic circuits, as conductor and insulator layers may be formed after embedding electronic devices. The purpose of this PAS is to obtain common understanding in design, fabrication and use of device embedded substrates in the industry. This PAS describes the substrate embedding devices including but not limited to module, integrated passive device (IPD), microelectrochemical systems (MEMS), discrete component formed in the fabrication process of the electronic wiring board, and sheet form component. This PAS does not specify the fabrication process of device embedded substrates, via diameter/via land diameter, conductor width/conductor spacing nor conductor line density.

Project

IEC PAS 62326-14:2010 ED1

Printed boards - Part 14: Device embedded substrate - Terminology / reliability / design guide