SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | WG 2 | Mr Yutaka Kumano | CDTR | 2021-12 | 2026 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PWI | 2021-02-12 | |||||
| preDTR | 2021-02-15 | |||||
| TDTR | 2021-02-17 | |||||
| CDTR |
| 2021-02-26 | 2021-04 | |||
| PRVDTR | 2021-04 | |||||
Project
IEC TR 63378-1 ED1
Thermal standardization on semiconductor packages – Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
Associated Documents:
47D/924A/INF
211 kB47D/920/DC
1276 kBRelated Projects
Is Merged Into - PWI TR 47D-1 ED1