SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | WG 2 | Mr Yutaka Kumano | PRVN | 2023-12 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| prePNW | 2020-12-16 | |||||
| PNW |
| 2020-12-18 | ||||
| PRVN | 2021-03-12 | 2021-03 | ||||
| 2021-04 | ||||||
656 kBProject
PNW 47D-926 ED1
Future 63xxx-2 Ed.1: Thermal standardization on semiconductor packaging – Part 2: 3D thermal simulation models of semiconductor packages for steady-state analysis