International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47DWG 2 K. UchidaDEL  

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/869A/NP PDF file 252 kB
2015-10-09 
DEL
47D/873/RVN Word file 128 kB
PDF file 135 kB
2016-02-192016-02
  

Project

PNW 47D-869A ED1

Future IEC 60191-X Ed.1: Requirement to semiconductor devices packaging materials from the environment point of view: Low Halogen Molding Compound