International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47DWG 2 S. MiyashitaPPUB2016-102020

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
47D/832/RR PDF file 64 kB
2013-05-02 
1CD
47D/834/CD PDF file 163 kB
2013-05-032013-11
CDM
47D/839/CC Word file 99 kB
PDF file 59 kB
2013-09-04 
ACDV
47D/839A/CC Word file 101 kB
PDF file 58 kB
2013-12-192013-11
CCDV
47D/850A/CDV
PDF file 349 kB
PDF file 319 kB
2014-03-282014-02
AFDIS
47D/854A/RVC Word file 104 kB
PDF file 139 kB
2014-08-222014-09
DECFDIS
2015-11-132015-02
RFDIS
2015-11-232015-11
CFDIS
47D/878/FDIS

2016-07-292016-02
APUB
47D/885/RVD PDF file 104 kB
2016-09-132016-09
BPUB
2016-09-142016-10
PPUB
2016-09-272016-11
  

Project

IEC 60191-6-13:2016 ED2

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)