International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47DWG 1 MERGED  

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47(SEC.)/1240/NWP  
1991-11-15 
ANW
47(SEC.)/1270/RVN  
1992-03-15 
1CD
47D(SEC.)/11/CD  
1993-10-01 
ACDV
1995-11-101994-02
CCDV
47D/170/CDV  
1997-04-041997-01
AFDIS
47D/207/RVC  
1998-01-231997-12
DECFDIS
1999-01-251998-05
MERGED
1999-02-09 
  

Project

IEC 60191-6/AMD1/FRAG5 ED1

IEC 191-6 - General rules for TSOP (Thin small outline package) Type II

 

 

Associated Documents:

47D/96/RM

 
47D/203/RM

 
47D/149/RM