International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47DWG 1 Mr. J.M. BirdMERGED  

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/359/NP PDF file 503 kB
2000-03-31 
ANW
47D/385/RVN PDF file 22 kB
2000-07-282000-08
CCDV
47D/408/CDV PDF file 422 kB
2000-12-222001-01
CCDV
47D/408A/CDV PDF file 12 kB
2000-12-222001-01
CDVM
47D/443/RVC PDF file 30 kB
2001-07-062001-08
AFDIS
2001-10-152001-11
DECFDIS
2001-12-192002-03
RFDIS
2001-12-202002-01
CFDIS
47D/488/FDIS
2002-02-012002-03
APUB
47D/502/RVD PDF file 103 kB
2002-04-112002-04
BPUB
2002-04-122002-05
MERGED
2002-04-15 
  

Project

IEC 60191-2/FRAG52 ED1

Plastic enhanced, thin profile quad flat pack (HTQFP) outline family, heat slug down, T-PQFP-G (Outline 153E)

 

 

Associated Documents:

47D/476/RM

PDF file 41 kB
47D/409/RM

PDF file 33 kB