International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 4 D.J. SOBERPPUB2009-062020

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/666/NP PDF file 354 kB
2007-04-06 
ANW
91/720/RVN PDF file 125 kB
2007-08-242007-08
CCDV
91/667/CDV PDF file 175 kB
2007-08-25 
AFDIS
91/837/RVC PDF file 244 kB
2008-12-262007-12
DECFDIS
2009-01-222009-02
RFDIS
2009-02-022009-02
CFDIS
91/852/FDIS
2009-02-272009-04
APUB
91/864/RVD PDF file 28 kB
2009-05-062009-04
BPUB
2009-05-072009-05
PPUB
2009-05-262009-06
  

Abstract

IEC 61249-4-16:2009 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according IEC 61249-2-37 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of non-halogenated flame retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier's instructions, the glass transition temperature is defined to be 150 °C and 200 °C.

Project

IEC 61249-4-16:2009 ED1

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

 

 

Associated Documents:

SMB/3860/DL

PDF file 285 kB