International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 11 | Dieter Bergman | WPUB | 2012-05 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2008-11-07 | ||||
| ANW |
| 2009-05-08 | 2009-03 | |||
| ANW |
| 2009-12-11 | ||||
| CCDV |
| 2009-12-18 | 2009-05 | |||
| AFDIS |
| 2010-09-17 | 2010-08 | |||
| DECFDIS | 2011-11-28 | 2011-08 | ||||
| RFDIS | 2011-12-01 | 2011-12 | ||||
| CFDIS |
| 2012-01-26 | 2012-02 | |||
| APUB |
| 2012-04-02 | 2012-03 | |||
| BPUB | 2012-04-03 | 2012-04 | ||||
| PPUB |
| 2012-04-27 | 2012-05 | |||
| WPUB | 2017-01-11 | 2016-12 | ||||
122 kBAbstract
IEC 61182-2-2:2012 provides the information on the manufacturing requirements used for fabricating printed boards. This standard determines the XML schema details, defined in the generic standard IEC 61182-2 and some of the sectional standards that are required to accomplish the focused tasks. When other standards are invoked, their requirements become a mandatory part of the fabrication details as defined in the IEC 61182-2.
Project
IEC 61182-2-2:2012 ED1
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
Associated Documents:
SMB/4536/DL
273 kB