International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |

Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
---|---|---|---|---|---|
TC 91 | WG 4 | D.J. Sober | PPUB | 2008-02 | 2020 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
---|---|---|---|---|---|---|
PNW |
| 2003-07-11 | ||||
ANW |
| 2004-05-07 | 2003-11 | |||
CCDV |
| 2005-12-16 | 2005-12 | |||
CDVM |
| 2006-09-22 | 2006-08 | |||
AFDIS |
| 2007-09-21 | 2006-11 | |||
DECFDIS | 2007-10-16 | 2007-09 | ||||
RFDIS | 2007-10-16 | 2007-10 | ||||
CFDIS |
| 2007-11-09 | 2008-01 | |||
APUB |
| 2008-01-14 | 2008-01 | |||
BPUB | 2008-01-15 | 2008-01 | ||||
PPUB | 2008-01-30 | 2008-02 | ||||
Project
IEC 61249-4-1:2008 ED1
Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
Associated Documents:
SMB/3130A/DL

