International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 10 | MERGED |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 1991-05-24 | ||||
| ANW |
| 1991-09-15 | ||||
| 1CD |
| 1994-03-18 | ||||
| ACDV |
| 1995-02-03 | ||||
| MERGED | 1995-07-07 | |||||
Project
IEC 61189-2/AMD1/FRAG18 ED1
Test methods for materials for interconnection structures - Test M27: Resin flow properties of coverlay films, bonding films and adhesive cast films used in the fabrication of flexible printed wiring boards