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TC 91
Electronics assembly technology
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Project files
>
Project: PNW 91-1035 ED1
Detail
Committee
Working Groups
Project Leader
Current
Status
Frcst Pub
Date
Stability
Date
TC 91
WG 10
Mr. H. Oka
DEL
 
History
Stage
Document
Downloads
Decision Date
Target Date
PNW
91/1035/NP
3742 kB
2012-03-22
DEL
2012-11-30
ANW
2012-08
Project
PNW 91-1035 ED1
Future IEC 61189-3-720: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Electrochemical migration test method
Associated Documents:
91/1077/RM
133 kB
SMB/5067/DL
211 kB
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