International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 10 | Prof. M. Lee | DEL | 2015-03 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2011-08-31 | ||||
| ANW |
| 2012-02-15 | 2012-01 | |||
| DEL | 2013-10-11 | |||||
Project
IEC 61189-2-629 ED1
Test method of adhesion between a dielectric and inkjet printed circuits to be used for printed elecronics sheet(board) application
Associated Documents:
SMB/4961/R
224 kB