International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91 WPUB  

History

Stage
Document
Downloads
Decision Date
Target Date
PPUB
1981-01-01 
WPUB
91/498/MCR PDF file 96 kB
2004-10-15 
  

Abstract

Covers the bonding sheet material used in the fabrication of multilayer printed boards. The test methods for bonding sheet material are also dealt with.

Project

IEC 60249-3-1:1981 ED2

Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards

 

 

Associated Documents:

52/763/RVS