TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3Mr Graham NaisbittPPUB2021-022025

History

Stage
Document
Downloads
Decision Date
Target Date
ACD
91/1535/RR PDF file 94 kB
2018-10-10 
CD
91/1569/CD
PDF file 725 kB
2019-04-052019-08
PCC
2019-06-282019-06
CDM
91/1606/CC PDF file 196 kB
Word file 39 kB
2019-08-302019-10
ACDV
91/1606A/CC PDF file 203 kB
Word file 38 kB
2019-12-272020-03
TCDV
2020-04-132020-06
CCDV
91/1645/CDV
PDF file 591 kB
2020-06-052020-06
TCDV
2020-06-292020-06
CCDV
2020-06-292020-06
PRVC
91/1672/RVC PDF file 171 kB
Word file 37 kB
2020-08-282020-08
APUB
2020-10-022020-10
TPUB
2020-10-02 
DECPUB
2020-11-092020-11
RPUB
2020-11-242020-11
BPUB
2021-01-042021-02
PPUB
2021-01-262021-02
  

Abstract

IEC 61189-5-501:2021 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture.

Project

IEC 61189-5-501:2021 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

 

Remark:

The other project leader is Emma Hudson.
 

 

Associated Documents:

91/1249A/INF

PDF file 233 kB