International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | DELPUB |
History
Stage | Document | Downloads | Decision Date | Target Date |
|---|---|---|---|---|
| ANW | 1984-06-01 | |||
| PPUB | 1989-08-15 | |||
| DELPUB | 1999-01-15 | |||
Project
IEC 60068-2-58:1989 ED1
Environmental testing. Part 2: Tests. Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)