International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 3 | Koichi Hagio | PPUB | 2013-05 | 2023 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2008-10-10 | ||||
| ANW |
| 2009-05-08 | 2009-02 | |||
| 1CD |
| 2009-08-14 | 2009-06 | |||
| A2CD |
| 2010-06-25 | 2009-12 | |||
| 2CD |
| 2011-02-25 | 2010-07 | |||
| ACDV |
| 2011-06-10 | 2011-05 | |||
| CCDV |
| 2011-09-07 | 2011-07 | |||
| AFDIS |
| 2012-04-19 | 2012-05 | |||
| DECFDIS | 2012-11-19 | 2012-08 | ||||
| RFDIS | 2012-11-28 | 2012-12 | ||||
| CFDIS |
| 2013-02-07 | 2013-02 | |||
| APUB |
| 2013-04-15 | 2013-04 | |||
| BPUB | 2013-04-16 | 2013-04 | ||||
| PPUB | 2013-05-07 | 2013-05 | ||||
227 kB
176 kBProject
IEC 61189-11:2013 ED1
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys