International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 2 DELPUB  

History

Stage
Document
Downloads
Decision Date
Target Date
BPUB
2010-09-16 
PPUB
2010-11-102010-11
DELPUB
2017-12-13 
WPUB
  

Abstract

IEC 61190-1-3:2007+A1:2010 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy solder powders, etc. This consolidated version consists of the second edition (2007) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.

Project

IEC 61190-1-3:2007+AMD1:2010 CSV ED2.1

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications