International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 2 Kaichi TsurutaDELPUB2007-06 

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/492/MCR PDF file 92 kB
2004-09-24 
1CD
91/521/CD PDF file 298 kB
2005-04-292004-11
CDM
91/542/CC PDF file 126 kB
2005-08-262005-08
ACDV
91/542A/CC PDF file 158 kB
2005-11-112005-11
CCDV
91/568/CDV PDF file 318 kB
2005-11-252005-11
CDVM
91/604/RVC PDF file 184 kB
2006-05-122006-06
AFDIS
91/604A/RVC PDF file 210 kB
2006-10-062006-07
DECFDIS
2006-10-272006-11
RFDIS
2006-11-062006-11
CFDIS
91/647/FDIS
2007-02-022007-02
APUB
91/679/RVD PDF file 118 kB
2007-04-132007-05
BPUB
2007-04-162007-06
PPUB
2007-04-262007-07
DELPUB
2017-12-13 
WPUB
  

Abstract

IEC 61190-1-3:2007 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an amendment to Table B.1 concerning lead-free solder alloys.

Project

IEC 61190-1-3:2007 ED2

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications