International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3Mr Martin WickhamPPUB2019-072024

History

Stage
Document
Downloads
Decision Date
Target Date
preDTR
2018-02-14 
TDTR
2018-02-14 
CDTR
91/1500/DTR
2018-02-232018-04
PRVDTR
2018-04-202018-04
APUB
91/1530/RVDTR PDF file 137 kB
Word file 120 kB
2018-09-142019-12
APUB
91/1530A/RVDTR PDF file 142 kB
Word file 143 kB
2018-09-142019-12
TPUB
2019-05-162019-06
DECPUB
2019-05-162019-07
RPUB
2019-06-032019-06
BPUB
2019-06-062019-08
PPUB
2019-06-262019-07
  

Project

IEC TR 61189-5-506:2019 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

 

Remark:

Project leader changed from Graham Naisbitt to Martin Wickham (91/1536/DL).