International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47DWG 2 Seiji HAMANOPPUB 2020

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/390/NP PDF file 113 kB
2000-09-08 
ANW
47D/413/RVN PDF file 23 kB
2001-01-122001-01
ACDV
2001-06-062001-08
CCDV
47D/469/CDV PDF file 110 kB
2001-10-122001-08
CDVM
47D/494/RVC PDF file 95 kB
2002-03-222002-06
AFDIS
47D/494A/RVC PDF file 108 kB
2002-08-162002-06
DECFDIS
2002-11-192002-08
RFDIS
2002-11-222002-12
CFDIS
47D/531/FDIS
2003-02-142003-02
APUB
47D/546/RVD PDF file 113 kB
2003-04-252003-05
BPUB
2003-04-282003-06
PPUB
2003-06-112003-07
  

Project

IEC 60191-6-4:2003 ED1

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

 

 

Associated Documents:

47D/515/RM

PDF file 100 kB
47D/447/RM

PDF file 48 kB
47D/409/RM

PDF file 33 kB