TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3Mr Shigeru SUGINOBPUB2021-022025

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/1322/RR PDF file 85 kB
2015-11-27 
ACD
2015-11-282015-11
CD
91/1518/CD
PDF file 791 kB
2018-06-222018-07
PCC
91/1599/CC PDF file 268 kB
Word file 206 kB
2018-09-142018-09
ACDV
2019-07-242019-07
TCDV
2019-07-262019-09
CCDV
91/1601/CDV
PDF file 925 kB
PDF file 944 kB
2019-09-132019-09
PRVC
2019-12-072019-12
APUB
91/1674/RVC PDF file 209 kB
Word file 52 kB
2020-10-092020-12
TPUB
2020-10-152020-12
DECPUB
2020-11-132020-12
RPUB
2020-12-032020-12
BPUB
2021-01-062021-02
PPUB
 2021-02

Abstract

IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys.

The printed boards materials for this organic rigid printed boards are epoxide woven E-glass laminated sheets that are specified in IEC 61249-2 (all parts).

The objective of this document is to ensure the soldering ability of the solder joint and of the lands of the printed boards. In addition, test methods are provided to ensure that the printed boards can resist the heat load to which they are exposed during soldering.


Project

IEC 61189-5-601 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

 

Remark:

Target date of 1CD changed to 2017-07 based on decision taken at TC 91 meeting in Frankfurt, Germany 2016-10-14.
Target date for the next stage after PCC changed from 2018-10 to 2019-08 (91/1536/DL).
Project plan - CDV: 2017-08, FDIS: 2018-06.
Mr Tsuyoshi Yamamoto is the other project leader.

 

Associated Documents:

91/1472/DL

PDF file 587 kB