TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 12Mr Hiroyuki ISHIBASHIRPUB2021-032026

History

Stage
Document
Downloads
Decision Date
Target Date
ACD
91/1592/RR PDF file 92 kB
2019-07-19 
CD
91/1604/CD
PDF file 873 kB
2019-08-022019-12
PCC
2019-09-272019-09
ACDV
91/1623/CC PDF file 161 kB
Word file 144 kB
2019-11-082020-07
TCDV
2020-01-102020-02
CCDV
91/1637/CDV
PDF file 710 kB
PDF file 710 kB
2020-02-282020-02
PRVC
2020-05-222020-05
APUB
91/1657/RVC PDF file 188 kB
Word file 152 kB
2020-06-262020-10
TPUB
2020-11-022020-10
DECPUB
2020-12-092020-12
RPUB
2020-12-222020-12
BPUB
 2021-03


Project

IEC 61188-6-2 ED1

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

 

Remark:

Project title has been changed from “Printed boards and printed boards assemblies“ to “Circuit boards and circuit boards assemblies“ (see 91/1605/RQ, 91/1591/Q).

 

Associated Documents:

91/1605/RQ

PDF file 152 kB
91/1591/Q

PDF file 144 kB
Word file 21 kB