TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 10Mr Ying GEPRVC2021-102026

History

Stage
Document
Downloads
Decision Date
Target Date
prePNW
2019-07-12 
PNW
91/1594/NP PDF file 2468 kB
2019-07-26 
PRVN
2019-10-182019-10
ACD
91/1632/RVN Word file 39 kB
PDF file 187 kB
2019-12-132020-01
CD
91/1634/CD
PDF file 829 kB
2019-12-202020-01
PCC
2020-03-132020-03
ACDV
91/1659/CC PDF file 150 kB
Word file 37 kB
2020-07-172020-10
TCDV
2020-07-202020-09
CCDV
91/1661/CDV
PDF file 851 kB
PDF file 830 kB
2020-09-112020-09
PRVC
2020-12-042020-12
 2021-02


Project

IEC 61189-2-501 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials