TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 10Mr Douglas J SoberCDM2022-04 

History

Stage
Document
Downloads
Decision Date
Target Date
prePNW
2017-09-19 
PNW
91/1466/NP PDF file 361 kB
2017-09-29 
PRVN
2017-12-222017-12
ACD
91/1492/RVN Word file 132 kB
PDF file 184 kB
2018-01-122018-09
CD
91/1543/CD
PDF file 324 kB
2018-11-092018-09
PCC
2019-02-012019-02
CDM
91/1611/CC PDF file 133 kB
Word file 36 kB
2019-09-132019-10
 2021-03


Project

IEC 61189-2-801 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

 

Remark:

Target date for next stage after CDM changed to 2021-03 (91/1685/DL).
SMB/7060/DL - CDV: 2020-09.
SMB/6840/DL - CDV: 2020-03.

 

Associated Documents:

91/1685/DL

PDF file 764 kB
SMB/7060/DL

PDF file 296 kB
SMB/6840/DL

PDF file 291 kB