International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | PT 61190 | Kaichi TSURUTA | CAN | 2007-04 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2003-03-07 | ||||
| ANW |
| 2003-08-29 | 2003-07 | |||
| ANW |
| 2003-10-03 | ||||
| PWI | 2005-02-10 | 2004-05 | ||||
| CAN | 2007-10-30 | |||||
Project
IEC 61190-1-6 ED1
Attachment materials for electronic assembly - Part-1-6: Requirements for electronic grade lead free solder alloys and fluxed and non-fluxed lead free solid solder for electronic soldering applications
Associated Documents:
SMB/2995A/DL
139 kB