International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 3 | Mr Martin Wickham | PPUB | 2019-07 | 2024 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| preDTR | 2018-02-14 | |||||
| TDTR | 2018-02-14 | |||||
| CDTR |
| 2018-02-23 | 2018-04 | |||
| PRVDTR | 2018-04-20 | 2018-04 | ||||
| APUB |
| 2018-09-14 | 2019-12 | |||
| APUB |
| 2018-09-14 | 2019-12 | |||
| TPUB | 2019-05-16 | 2019-06 | ||||
| DECPUB | 2019-05-16 | 2019-07 | ||||
| RPUB | 2019-06-03 | 2019-06 | ||||
| BPUB | 2019-06-06 | 2019-08 | ||||
| PPUB | 2019-06-26 | 2019-07 | ||||
137 kB
120 kBProject
IEC TR 61189-5-506:2019 ED1
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
Remark:
Project leader changed from Graham Naisbitt to Martin Wickham (91/1536/DL).