International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 1 | Mr Walter Huck | PPUB | 2018-03 | 2025 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| ACDV |
| 2016-12-14 | ||||
| TCDV | 2016-12-22 | 2016-12 | ||||
| CCDV |
| 2017-02-10 | 2017-02 | |||
| PRVC | 2017-05-05 | 2017-05 | ||||
| APUB |
| 2017-11-17 | 2018-05 | |||
| TPUB | 2017-11-22 | 2018-05 | ||||
| DECPUB | 2018-01-04 | 2018-01 | ||||
| RPUB | 2018-01-08 | 2018-01 | ||||
| BPUB | 2018-02-16 | 2018-04 | ||||
| PPUB | 2018-03-13 | 2018-03 | ||||
117 kBProject
IEC 61760-4:2015/AMD1:2018 ED1
Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
Associated Documents:
91/1472/DL
587 kB