International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3 Udo WelzelPPUB2014-102023

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/1151/RR PDF file 22 kB
2013-11-08 
CDTR
91/1158/DTR PDF file 5715 kB
PDF file 5744 kB
2013-12-182014-01
APUB
91/1177/RVC Word file 126 kB
PDF file 61 kB
2014-03-142014-05
DECPUB
2014-08-142014-10
BPUB
2014-09-012014-08
RPUB
2014-09-05 
PPUB
2014-10-172014-12
  

Abstract

IEC TR 60068-3-12:2014 presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a large range of package sizes (e.g. molded active electronic components, passive components and electromechanical components). Study A addresses requirements needed in the production of high-reliability electronic control units (ECU), as for example in automotive electronics. These requirements include measurement and production tolerances. Study B represents consumer electronics products and includes reflow oven capability, board design and package sizes. This edition includes the following significant technical changes with respect to the previous edition:
- the content has been adapted to the state-of-the-art of reflow-oven technology and termination finishes;
- minor language adjustments were performed.

Project

IEC TR 60068-3-12:2014 ED2

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile