International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91 MERGED2008-05 

History

Stage
Document
Downloads
Decision Date
Target Date
BPUB
2008-03-12 
DECPUB
2008-03-12 
RPUB
2008-04-17 
PPUB
2008-05-272008-06
MERGED
2008-05-27 
  

Abstract

IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.

Project

IEC 61190-1-2/FRAGF ED2

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly