International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3Mr Kaichi TsurutaACD2021-12 

History

Stage
Document
Downloads
Decision Date
Target Date
PWI
2019-04-04 
prePNW
2019-05-232019-07
PNW
91/1581/NP PDF file 869 kB
2019-05-242019-06
PRVN
2019-08-162019-08
ACD
91/1609/RVN Word file 43 kB
PDF file 234 kB
2019-09-062019-12
CD
 2019-12

Project

IEC 61189-5-301 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder powders

 

Remark:

This is a joint project between WG 2 and WG 3.