International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | MERGED | 2008-05 |
History
Stage | Document | Downloads | Decision Date | Target Date |
|---|---|---|---|---|
| BPUB | 2008-03-12 | |||
| DECPUB | 2008-03-12 | |||
| RPUB | 2008-04-17 | |||
| PPUB | 2008-05-27 | 2008-06 | ||
| MERGED | 2008-05-27 | |||
Project
IEC 61190-1-3/FRAGF ED2
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications