International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 4 | D.J. SOBER | PPUB | 2008-12 | 2020 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2007-04-06 | ||||
| ANW |
| 2007-08-24 | 2007-08 | |||
| CCDV |
| 2007-08-25 | ||||
| AFDIS |
| 2008-07-11 | 2007-12 | |||
| DECFDIS | 2008-08-11 | 2008-04 | ||||
| RFDIS | 2008-08-18 | 2008-08 | ||||
| CFDIS |
| 2008-09-05 | 2008-11 | |||
| APUB |
| 2008-11-13 | 2008-11 | |||
| BPUB | 2008-11-14 | 2008-11 | ||||
| PPUB | 2008-11-27 | 2008-12 | ||||
206 kBProject
IEC 61249-2-37:2008 ED1
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly