International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 4 | Mr Jianwei Cai | PPUB | 2018-01 | 2023 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| prePNW | 2017-01-25 | |||||
| PNW |
| 2017-01-27 | ||||
| PRVN | 2017-03-24 | 2017-03 | ||||
| ACDV |
| 2017-04-07 | 2017-09 | |||
| TCDV | 2017-06-22 | 2017-09 | ||||
| CCDV |
| 2017-08-11 | 2017-08 | |||
| PRVC | 2017-11-03 | 2017-11 | ||||
| APUB |
| 2017-11-10 | 2018-02 | |||
| TPUB | 2017-11-27 | 2018-02 | ||||
| DECPUB | 2017-11-27 | 2018-01 | ||||
| RPUB | 2017-11-29 | 2017-12 | ||||
| BPUB | 2017-12-05 | 2018-02 | ||||
| PPUB | 2018-01-10 | 2018-01 | ||||
350 kB
125 kBProject
IEC 61249-2-46:2018 ED1
Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly