International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3 Yoshiharu KARIYAPPUB2009-022023

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/638/NP PDF file 445 kB
2006-10-13 
ANW
91/650/RVN PDF file 147 kB
2007-02-022007-02
ANW
91/650A/RVN PDF file 97 kB
2007-06-012007-06
1CD
91/695/CD PDF file 381 kB
2007-06-152007-06
ACDV
91/740/CC PDF file 114 kB
2007-11-232007-10
CCDV
91/743/CDV PDF file 385 kB
2007-11-23 
AFDIS
91/778/RVC PDF file 168 kB
2008-07-112008-07
DECFDIS
2008-09-252008-09
RFDIS
2008-10-032008-10
CFDIS
91/826/FDIS

2008-11-142008-12
APUB
91/841/RVD PDF file 28 kB
2009-01-212009-01
BPUB
2009-01-222009-01
PPUB
2009-02-112009-02
  

Abstract

IEC 62137-1-5:2009 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the reliability of solder joints. Another method is to mechanically cycle the solder joints to shorten the testing time rather than to produce the strains by changing temperatures. The methodology is the imposition of shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by CTE (coefficient of thermal expansion) mismatch, as shown in Figure 2. In place of the temperature cycle test, the mechanical shear fatigue predicts the reliability of the solder joints under repeated temperature change conditions by mechanically cycling the solder joints. In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclic mechanical shear deformation is applied to the solder joints until fracture of the solder joints occurs. The properties of the solder joints (for example solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Project

IEC 62137-1-5:2009 ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test