International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 4 | PPUB | 2023 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW | 1989-11-01 | |||||
| ANW | 1989-11-16 | |||||
| 1CD |
| 1991-11-01 | ||||
| CCDV |
| 1993-09-03 | ||||
| AFDIS |
| 1994-06-17 | ||||
| RFDIS | 1995-03-09 | 1995-01 | ||||
| CFDIS |
| 1995-05-26 | ||||
| APUB |
| 1995-10-17 | 1995-10 | |||
| BPUB | 1995-10-18 | 1995-11 | ||||
| PPUB | 1995-11-28 | 1996-01 | ||||
Project
IEC 61249-5-1:1995 ED1
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)