International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 2 | R. Taube | PPUB | 2017-06 | 2024 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| AMW |
| 2012-11-12 | ||||
| 1CD |
| 2015-09-04 | 2015-11 | |||
| ACDV |
| 2015-12-11 | 2015-12 | |||
| TCDV |
| 2016-10-23 | 2016-10 | |||
| CCDV | 2017-03-20 | 2017-03 | ||||
| PRVC | 2017-03-22 | 2017-03 | ||||
| APUB |
| 2017-03-24 | 2017-11 | |||
| TPUB | 2017-04-21 | 2017-11 | ||||
| DECPUB | 2017-04-21 | 2017-06 | ||||
| RPUB | 2017-04-27 | 2017-05 | ||||
| BPUB | 2017-05-15 | 2017-07 | ||||
| PPUB | 2017-05-30 | 2017-06 | ||||
110 kBProject
IEC 61191-3:2017 ED2
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Remark:
Target date of CCDV changed to 2017-01 based on decision taken at TC 91 meeting in Frankfurt, Germany 2016-10-14.
Associated Documents:
SMB/5690A/DL
432 kBSMB/5617/DL
449 kBSMB/5436/DL
237 kB