International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 10 | Udo Welzel | PPUB | 2016-01 | 2023 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2012-02-20 | ||||
| ANW |
| 2012-11-27 | 2012-07 | |||
| 1CD |
| 2013-11-11 | 2013-11 | |||
| ACDV |
| 2014-02-12 | 2014-02 | |||
| CCDV |
| 2014-09-12 | 2014-10 | |||
| AFDIS |
| 2015-01-09 | 2015-03 | |||
| DECFDIS | 2015-07-24 | 2015-03 | ||||
| RFDIS | 2015-08-03 | 2015-08 | ||||
| CFDIS |
| 2015-09-25 | 2015-10 | |||
| APUB |
| 2015-12-02 | 2015-11 | |||
| APUB |
| 2015-12-02 | ||||
| BPUB | 2015-12-03 | 2015-12 | ||||
| BPUB | 2015-12-03 | |||||
| PPUB | 2016-01-05 | 2016-01 | ||||
114 kBProject
IEC 61189-3-719:2016 ED1
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
Associated Documents:
SMB/5155/DL
207 kB