International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 6 Kunio TakaharaPPUB2015-032022

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/996/NP PDF file 905 kB
2011-08-31 
ANW
91/1031B/RVN PDF file 153 kB
2012-03-222012-01
1CD
91/1081/CD PDF file 1316 kB
2013-01-222013-01
ACDV
91/1116/CC Word file 136 kB
PDF file 72 kB
2013-07-192013-04
CDTS
91/1142/DTS PDF file 1427 kB
PDF file 1390 kB
2013-09-042013-10
APUB
91/1163A/RVC Word file 117 kB
PDF file 66 kB
2014-01-282014-03
DECPUB
2014-10-242014-10
BPUB
2014-11-032014-11
RPUB
2014-12-01 
PPUB
2015-03-302015-03
  

Abstract

IEC TS 62878-2-1:2015 describes the basics of device embedding substrate. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

Project

IEC TS 62878-2-1:2015 ED1

Device embedded substrate - Part 2-1: Guidelines - General description of technology

 

 

Associated Documents:

91/1115/INF

PDF file 21 kB