International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3 Kuniaki TAKAHASHIPPUB2009-012023

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/637/NP PDF file 586 kB
2006-10-13 
ANW
91/649/RVN PDF file 423 kB
2007-02-022007-02
ANW
91/649A/RVN PDF file 158 kB
2007-06-012007-06
1CD
91/694/CD PDF file 311 kB
2007-06-152007-06
ACDV
91/745/CC PDF file 113 kB
2007-11-232007-10
CCDV
91/746/CDV PDF file 649 kB
2007-11-232007-11
AFDIS
91/776/RVC PDF file 243 kB
2008-07-042008-07
DECFDIS
2008-07-312008-09
RFDIS
2008-08-052008-08
CFDIS
91/815/FDIS

2008-09-192008-10
APUB
91/835/RVD PDF file 187 kB
2008-11-242008-11
BPUB
2008-11-252008-12
PPUB
2009-01-262009-01
  

Abstract

The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.

Project

IEC 62137-1-4:2009 ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test