TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 10Mr Hyun Ho KimCD2023-10 

History

Stage
Document
Downloads
Decision Date
Target Date
prePNW
2020-01-22 
PNW
91/1638/NP PDF file 656 kB
2020-01-24 
PRVN
2020-04-172020-04
ACD
91/1667/RVN  
2020-09-182021-10
ACD
91/1667A/RVN Word file 150 kB
PDF file 329 kB
2020-09-182021-10
CD
91/1690/CD
PDF file 687 kB
2020-12-082021-10
PCC
 2021-02


Project

IEC 61189-2-808 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808: Thermal resistance of dielectric layer by thermal transient method