TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 3 | Mr Kaichi Tsuruta | TPUB | 2021-06 | 2026 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PWI | 2019-04-04 | |||||
| prePNW | 2019-05-23 | 2019-07 | ||||
| PNW |
| 2019-05-24 | 2019-06 | |||
| PRVN | 2019-08-16 | 2019-08 | ||||
| ACD |
| 2019-09-06 | 2019-12 | |||
| CD |
| 2019-11-08 | 2019-12 | |||
| PCC | 2020-01-31 | 2020-01 | ||||
| ACDV |
| 2020-06-19 | 2020-08 | |||
| TCDV | 2020-06-23 | 2020-08 | ||||
| CCDV |
| 2020-08-14 | 2020-08 | |||
| PRVC | 2020-11-06 | 2020-11 | ||||
| APUB |
| 2020-12-18 | 2021-04 | |||
| TPUB | 2021-01-04 | 2021-04 | ||||
| DECPUB | 2021-02 | |||||
869 kB
43 kBProject
IEC 61189-5-301 ED1
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
Remark:
This is a joint project between WG 2 and WG 3.